This research report presents forecast and recent quarter review of the worldwide motherboard application IC market. The report includes motherboard shipment volume and breakdowns by CPU supplier, CPU connector type, chipset supplier, and chipset type. The content of this report is based on primary data obtained through interviews with motherboard component makers. The report finds that worldwide motherboard application IC market volume continued to drop in the second quarter of 2010. It is forecasted that the market volume will rebound in the third quarter, seeing a sequential growth but still suffering from a year-on-year decline, while the fourth-quarter market volume is expected to slightly slow down following a strong pick-up in the third quarter.